3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military,
3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military,